Trending Products Wire Edm Machine - Micropore Laser Perforation Machine for semiconductor – FOREST
Trending Products Wire Edm Machine - Micropore Laser Perforation Machine for semiconductor – FOREST Detail:
The minimum processing micropore diameter is 5μm, the overall processing accuracy is ±4μm, the local feature accuracy is less than 3μm, and the processing width is 300*300mm. .
Mainly used for: microelectronic device manufacturing, printing template preparation, biochip preparation, precision mold forming, instrumentation precision parts manufacturing
1. Using high-power and high-stability UV laser to directly ablate the gasification material, with a μm-level processing aperture and a μm-level heat-affected zone;
2. High-speed and high-precision control of beam deflection through imported precision galvanometers to achieve high-speed small-format precision micro-hole processing;
3. High-speed and high-precision large-format micro-hole processing is realized by the translation of the micron-level high-speed linear motor platform;
4. The Z-axis is electrically adjustable to adapt to materials of different thicknesses and to meet specific taper hole processing requirements;
5. The range axis super-resolution industrial camera is used for full-frame error correction of the galvanometer, ultra-high-precision focusing, and online measurement to ensure the long-term stability and accuracy of the system;
6. The system adopts marble countertops to improve the overall stability of the system, and all mechanical components are carefully selected to ensure long-term accuracy;
7. The minimum processing micropore diameter is 5μm, the overall processing accuracy is ±4μm, the local feature accuracy is less than 3μm, and the processing width is 300*300mm;
8. It is used for precision micromachining of metals, ceramics, silicon wafers, glass, organics and other materials, such as micro-hole processing and precision cutting.
Compared with EDM micro-hole processing, mechanical drilling, chemical corrosion, mechanical punching, etc., laser precision micro-hole machining has the following advantages:
High speed (up to 4000 holes per second)
High precision (<3μm)
No material restrictions (metals, ceramics, silicon wafers, organics, etc.)
Programmable hole pattern (minimum 5μm, specific taper hole)
Distribution can be customized (processing width 300mm*300mm), no mold and mask required
No pollution and no consumables
direct processing
Items | Parameter | FM-UVM3A | FM-UVM3B |
Laser | wave | 355nm | |
Power | >3W@40kHz (3-40W optional) | ||
modulating frequency | 1~200kHz | ||
Pulse width | 15ns@40kHz | ||
beam quality | <1.2 | ||
Galvo | Scan area | <50*50mm | <15*15mm |
Repeatability accuracy | <1um | ||
Positioning accuracy | ≤±3um | ||
X Y tables | Travel | 300*300mm (600*600mm optional) | |
Positioning resolution | 0.1um | ||
Repeatability accuracy | ≤±1um | ||
Positioning accuracy | ≤±3um | ||
Acceleration | ≤1G | ||
Speed | ≤200mm/s | ||
Z axis | Travel | 150mm | |
Repeatability accuracy | ≤±3um | ||
Positioning accuracy | ≤±5um | ||
CCD monitoring positioning |
Camera | five-megapixel | |
Optical magnification | 10X | ||
region splicing | accuracy | ±3μm | |
Processing | Minimum spot | 8um | 5um |
Hole processing accuracy | ±5um | ||
Repeatability accuracy | ≤±1um | ||
Available materials for procesing | Glass, organics, metals, ceramics, etc. | ||
GGGGApplication | Pipe bottle | ok | good |
die bottle | ok | good | |
Plastic bottle | not good | ok | |
Soft bags | No available | ok | |
Coolant system | Water coolant (1500W cooling capacity ) | ||
Power supply | 220V, 50~60HZ, 1 phase or customized | ||
Power | ≤2000W | ||
Measure(mm) | 1200*1200*1900mm | ||
Weight (KG) | 1200Kg |
Note: Constant temperature (25±0.5℃), obtained after preheating for 30 minutes
Product detail pictures:
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High quality Initial,and Buyer Supreme is our guideline to offer the ideal assistance to our shoppers.At present, we are striving our best to become amongst the ideal exporters inside our industry to satisfy shoppers more want for Trending Products Wire Edm Machine - Micropore Laser Perforation Machine for semiconductor – FOREST, The product will supply to all over the world, such as: Somalia, Myanmar, Istanbul, Our mission is Provide Goods with Reliable Quality and Reasonable Prices. We welcome customers from every corner of the world to contact us for future business relationships and achieving mutual success!
By Gill from Zambia - 2017.09.29 11:19
It can be said that this is a best producer we encountered in China in this industry, we feel lucky to work with so excellent manufacturer.
By Muriel from Algeria - 2018.12.05 13:53