Manufactur standard Engine Hone Brush - Micropore Laser Perforation Machine for semiconductor – FOREST

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Manufactur standard Engine Hone Brush - Micropore Laser Perforation Machine for semiconductor – FOREST Detail:

The minimum processing micropore diameter is 5μm, the overall processing accuracy is ±4μm, the local feature accuracy is less than 3μm, and the processing width is 300*300mm. .

Mainly used for: microelectronic device manufacturing, printing template preparation, biochip preparation, precision mold forming, instrumentation precision parts manufacturing

1. Using high-power and high-stability UV laser to directly ablate the gasification material, with a μm-level processing aperture and a μm-level heat-affected zone;

2. High-speed and high-precision control of beam deflection through imported precision galvanometers to achieve high-speed small-format precision micro-hole processing;

3. High-speed and high-precision large-format micro-hole processing is realized by the translation of the micron-level high-speed linear motor platform;

4. The Z-axis is electrically adjustable to adapt to materials of different thicknesses and to meet specific taper hole processing requirements;

5. The range axis super-resolution industrial camera is used for full-frame error correction of the galvanometer, ultra-high-precision focusing, and online measurement to ensure the long-term stability and accuracy of the system;

6. The system adopts marble countertops to improve the overall stability of the system, and all mechanical components are carefully selected to ensure long-term accuracy;

7. The minimum processing micropore diameter is 5μm, the overall processing accuracy is ±4μm, the local feature accuracy is less than 3μm, and the processing width is 300*300mm;

8. It is used for precision micromachining of metals, ceramics, silicon wafers, glass, organics and other materials, such as micro-hole processing and precision cutting.

Compared with EDM micro-hole processing, mechanical drilling, chemical corrosion, mechanical punching, etc., laser precision micro-hole machining has the following advantages:

High speed (up to 4000 holes per second)

High precision (<3μm)

No material restrictions (metals, ceramics, silicon wafers, organics, etc.)

Programmable hole pattern (minimum 5μm, specific taper hole)

Distribution can be customized (processing width 300mm*300mm), no mold and mask required

No pollution and no consumables

direct processing

Items	Parameter	FM-UVM3A	FM-UVM3B
Laser	wave	355nm
	Power	＞3W@40kHz （3-40W optional）
	modulating frequency	1~200kHz
	Pulse width	15ns@40kHz
	beam quality	＜1.2
Galvo	Scan area	＜50*50mm	＜15*15mm
	Repeatability accuracy	＜1um
	Positioning accuracy	≤±3um
X Y tables	Travel	300300mm （600600mm optional）
	Positioning resolution	0.1um
	Repeatability accuracy	≤±1um
	Positioning accuracy	≤±3um
	Acceleration	≤1G
	Speed	≤200mm/s
Z axis	Travel	150mm
	Repeatability accuracy	≤±3um
	Positioning accuracy	≤±5um
CCD monitoring positioning	Camera	five-megapixel
	Optical magnification	10X
region splicing	accuracy	±3μm
Processing	Minimum spot	8um	5um
	Hole processing accuracy	±5um
	Repeatability accuracy	≤±1um
	Available materials for procesing	Glass, organics, metals, ceramics, etc.
GGGGApplication	Pipe bottle	ok	good
	die bottle	ok	good
	Plastic bottle	not good	ok
	Soft bags	No available	ok
Coolant system	Water coolant (1500W cooling capacity )
Power supply	220V, 50~60HZ, 1 phase or customized
Power	≤2000W
Measure(mm)	120012001900mm
Weight (KG)	1200Kg

Note: Constant temperature (25±0.5℃), obtained after preheating for 30 minutes

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