WUXI FOREST TRADE CO., LTD IS BUILT IN 2018 YEAR

Micropore Laser Perforation Machine no ka semiconductor

ʻO ka wehewehe pōkole:

Noi: Ke aniani, nā mea ola, metala, keramika, etc.

ʻO ke anawaena puka liʻiliʻi: 5μm

Pono:±4μm,

Pono ka hiʻona kūloko: <3μm


Huahana Huahana

Huahana Huahana

ʻO ke anawaena micropore ka palena iki he 5μm, ʻo ka pololei o ka hana holoʻokoʻa he ± 4μm, ʻoi aku ka pololei o ka hiʻohiʻona kūloko ma mua o 3μm, a ʻo 300 * 300mm ka laulā..

Hoʻohana nui ʻia no: ka hana ʻana i nā mea microelectronic, ka hoʻomākaukau ʻana i ka laʻana paʻi, ka hoʻomākaukau ʻana i ka biochip, ka hoʻokumu ʻana i ka mold, ka hana ʻana i nā ʻāpana kikoʻī.

1. Ke hoʻohana nei i ka laser UV mana kiʻekiʻe a me ke kūpaʻa kiʻekiʻe e hoʻopau pololei i ka mea hoʻoheheʻe, me kahi puka hoʻoponopono μm-level a me kahi μm-level wela wela;

2. Kiʻekiʻe-māmā a me ka kiʻekiʻe-pololei ka mana o ka beam deflection ma o ka mea i laweia mai pololei galvanometers e hoʻokō i kiʻekiʻe-kiʻekiʻe-format precision micro-hole hana;

3. Hoʻomaopopo ʻia ka ʻōnaehana micro-hole kiʻekiʻe kiʻekiʻe a me ka kiʻekiʻe e ka unuhi ʻana o ka micron-level high-speed linear motor platform;

4. Hiki ke ho'ololi 'ia ka Z-axis no ka ho'ololi 'ana i nā mea o nā mānoanoa like 'ole a no ka ho'okō 'ana i nā koi o ka ho'oponopono 'ana o ka lua taper;

5. Hoʻohana ʻia ka pahu kiʻi kiʻi kiʻi kiʻekiʻe kiʻekiʻe kiʻekiʻe kiʻekiʻe, a me ke ana pūnaewele e hōʻoia i ka paʻa a me ka pololei o ka ʻōnaehana no ka manawa lōʻihi;

6. Hoʻohana ka ʻōnaehana i nā countertops marble e hoʻomaikaʻi i ka paʻa holoʻokoʻa o ka ʻōnaehana, a koho pono ʻia nā ʻāpana mechanical āpau e hōʻoia i ka pololei o ka wā lōʻihi;

7. ʻO 5μm ke anawaena o ka micropore hana liʻiliʻi, ʻo ± 4μm ka pololei o ka hana ʻana, ʻoi aku ka pololei o ka hiʻohiʻona kūloko ma mua o 3μm, a ʻo 300 * 300mm ka laulā;

8. Hoʻohana ʻia ia no ka micromachining precision o nā metala, ceramics, wafers silicon, aniani, organics a me nā mea ʻē aʻe, e like me ka hana micro-hole a me ka ʻoki pololei.

Hoʻohālikelike ʻia me ka EDM micro-hole processing, mechanical drilling, chemical corrosion, mechanical punching, etc., laser precision micro-hole machining i kēia mau mea pono:

ʻO ka wikiwiki kiʻekiʻe (a hiki i 4000 mau puka i kekona)

pololei kiʻekiʻe (<3μm)

ʻAʻohe mea ʻae ʻia (metala, keramika, wafer silika, organika, etc.)

ʻO ke kumu hoʻohālike puka polokalamu (5μm liʻiliʻi, puka kiko kikoʻī)

Hiki ke hoʻopilikino ʻia ka hāʻawi ʻana (ka laulā hana 300mm * 300mm), ʻaʻohe pono a me ka mask.

ʻAʻohe haumia a ʻaʻohe mea hoʻopau

hana pololei

Nā mea ʻĀpana FM-UVM3A FM-UVM3B
Laser nalu 355nm
Ka mana >3W@40kHz (3-40W koho)
hoʻololi pinepine 1~200kHz
Pulse laula 15ns@40kHz
maikaʻi kaola <1.2
Galvo ʻĀpana nānā <50*50mm <15*15mm
Ka pololei o ka hana hou <1um
Ka pololei o ka hoonoho ana ≤±3um
XY papa Kaahele 300*300mm (600*600mm koho)
Hoʻoholo kūlana 0.1um
Ka pololei o ka hana hou ≤±1um
Ka pololei o ka hoonoho ana ≤±3um
ʻO ka wikiwiki ≤1G
Ka māmā holo ≤200mm/s
Z axis Kaahele 150mm
Ka pololei o ka hana hou ≤±3um
Ka pololei o ka hoonoho ana ≤±5um

ʻO ke kūlana nānā ʻana o ka CCD

Kāmeʻa ʻelima-megapixel
Hoʻonui ʻike 10X
ʻāpana ʻāina pololei ±3μm
Kaʻina hana wahi liʻiliʻi 8um 5um
ʻO ka pololei o ka hoʻoponopono ʻana i ka puka ±5um
Ka pololei o ka hana hou ≤±1um
Loaʻa nā mea hana no ka hana ʻO ke aniani, nā mea kūlohelohe, nā metala, nā seramika, etc.
GGGGApalapala ʻOmole paipu ok maikaʻi loa
ʻōmole make ok maikaʻi loa
ʻOmole palaki maikaʻi ʻole ok
ʻeke palupalu ʻAʻole loaʻa ok
Pūnaehana hoʻoluʻu Mea hooluolu wai (1500W mana hooluolu)
Lako ikehu 220V, 50~60HZ, 1 pae a i ʻole maʻamau
Ka mana ≤2000W
Ana(mm) 1200*1200*1900mm
Kaumaha (KG) 1200Kg

'Ōlelo Aʻo: Ka wela mau (25±0.5 ℃), loaʻa ma hope o preheating no 30 minuke


  • Mua:
  • Aʻe:

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