Micropore Laser Perforation Machine no ka semiconductor
ʻO ke anawaena micropore ka palena iki he 5μm, ʻo ka pololei o ka hana holoʻokoʻa he ± 4μm, ʻoi aku ka pololei o ka hiʻohiʻona kūloko ma mua o 3μm, a ʻo 300 * 300mm ka laulā..
Hoʻohana nui ʻia no: ka hana ʻana i nā mea microelectronic, ka hoʻomākaukau ʻana i ka laʻana paʻi, ka hoʻomākaukau ʻana i ka biochip, ka hoʻokumu ʻana i ka mold, ka hana ʻana i nā ʻāpana kikoʻī.
1. Ke hoʻohana nei i ka laser UV mana kiʻekiʻe a me ke kūpaʻa kiʻekiʻe e hoʻopau pololei i ka mea hoʻoheheʻe, me kahi puka hoʻoponopono μm-level a me kahi μm-level wela wela;
2. Kiʻekiʻe-māmā a me ka kiʻekiʻe-pololei ka mana o ka beam deflection ma o ka mea i laweia mai pololei galvanometers e hoʻokō i kiʻekiʻe-kiʻekiʻe-format precision micro-hole hana;
3. Hoʻomaopopo ʻia ka ʻōnaehana micro-hole kiʻekiʻe kiʻekiʻe a me ka kiʻekiʻe e ka unuhi ʻana o ka micron-level high-speed linear motor platform;
4. Hiki ke ho'ololi 'ia ka Z-axis no ka ho'ololi 'ana i nā mea o nā mānoanoa like 'ole a no ka ho'okō 'ana i nā koi o ka ho'oponopono 'ana o ka lua taper;
5. Hoʻohana ʻia ka pahu kiʻi kiʻi kiʻi kiʻekiʻe kiʻekiʻe kiʻekiʻe kiʻekiʻe, a me ke ana pūnaewele e hōʻoia i ka paʻa a me ka pololei o ka ʻōnaehana no ka manawa lōʻihi;
6. Hoʻohana ka ʻōnaehana i nā countertops marble e hoʻomaikaʻi i ka paʻa holoʻokoʻa o ka ʻōnaehana, a koho pono ʻia nā ʻāpana mechanical āpau e hōʻoia i ka pololei o ka wā lōʻihi;
7. ʻO 5μm ke anawaena o ka micropore hana liʻiliʻi, ʻo ± 4μm ka pololei o ka hana ʻana, ʻoi aku ka pololei o ka hiʻohiʻona kūloko ma mua o 3μm, a ʻo 300 * 300mm ka laulā;
8. Hoʻohana ʻia ia no ka micromachining precision o nā metala, ceramics, wafers silicon, aniani, organics a me nā mea ʻē aʻe, e like me ka hana micro-hole a me ka ʻoki pololei.
Hoʻohālikelike ʻia me ka EDM micro-hole processing, mechanical drilling, chemical corrosion, mechanical punching, etc., laser precision micro-hole machining i kēia mau mea pono:
ʻO ka wikiwiki kiʻekiʻe (a hiki i 4000 mau puka i kekona)
pololei kiʻekiʻe (<3μm)
ʻAʻohe mea ʻae ʻia (metala, keramika, wafer silika, organika, etc.)
ʻO ke kumu hoʻohālike puka polokalamu (5μm liʻiliʻi, puka kiko kikoʻī)
Hiki ke hoʻopilikino ʻia ka hāʻawi ʻana (ka laulā hana 300mm * 300mm), ʻaʻohe pono a me ka mask.
ʻAʻohe haumia a ʻaʻohe mea hoʻopau
hana pololei
Nā mea | ʻĀpana | FM-UVM3A | FM-UVM3B |
Laser | nalu | 355nm | |
Ka mana | >3W@40kHz (3-40W koho) | ||
hoʻololi pinepine | 1~200kHz | ||
Pulse laula | 15ns@40kHz | ||
maikaʻi kaola | <1.2 | ||
Galvo | ʻĀpana nānā | <50*50mm | <15*15mm |
Ka pololei o ka hana hou | <1um | ||
Ka pololei o ka hoonoho ana | ≤±3um | ||
XY papa | Kaahele | 300*300mm (600*600mm koho) | |
Hoʻoholo kūlana | 0.1um | ||
Ka pololei o ka hana hou | ≤±1um | ||
Ka pololei o ka hoonoho ana | ≤±3um | ||
ʻO ka wikiwiki | ≤1G | ||
Ka māmā holo | ≤200mm/s | ||
Z axis | Kaahele | 150mm | |
Ka pololei o ka hana hou | ≤±3um | ||
Ka pololei o ka hoonoho ana | ≤±5um | ||
ʻO ke kūlana nānā ʻana o ka CCD | Kāmeʻa | ʻelima-megapixel | |
Hoʻonui ʻike | 10X | ||
ʻāpana ʻāina | pololei | ±3μm | |
Kaʻina hana | wahi liʻiliʻi | 8um | 5um |
ʻO ka pololei o ka hoʻoponopono ʻana i ka puka | ±5um | ||
Ka pololei o ka hana hou | ≤±1um | ||
Loaʻa nā mea hana no ka hana | ʻO ke aniani, nā mea kūlohelohe, nā metala, nā seramika, etc. | ||
GGGGApalapala | ʻOmole paipu | ok | maikaʻi loa |
ʻōmole make | ok | maikaʻi loa | |
ʻOmole palaki | maikaʻi ʻole | ok | |
ʻeke palupalu | ʻAʻole loaʻa | ok | |
Pūnaehana hoʻoluʻu | Mea hooluolu wai (1500W mana hooluolu) | ||
Lako ikehu | 220V, 50~60HZ, 1 pae a i ʻole maʻamau | ||
Ka mana | ≤2000W | ||
Ana(mm) | 1200*1200*1900mm | ||
Kaumaha (KG) | 1200Kg |
'Ōlelo Aʻo: Ka wela mau (25±0.5 ℃), loaʻa ma hope o preheating no 30 minuke