100% Original Factory Glass Grinding Machine - Micropore Laser Perforation Machine for semiconductor – FOREST

The minimum processing micropore diameter is 5μm, the overall processing accuracy is ±4μm, the local feature accuracy is less than 3μm, and the processing width is 300*300mm. .

Mainly used for: microelectronic device manufacturing, printing template preparation, biochip preparation, precision mold forming, instrumentation precision parts manufacturing

1. Using high-power and high-stability UV laser to directly ablate the gasification material, with a μm-level processing aperture and a μm-level heat-affected zone;

2. High-speed and high-precision control of beam deflection through imported precision galvanometers to achieve high-speed small-format precision micro-hole processing;

3. High-speed and high-precision large-format micro-hole processing is realized by the translation of the micron-level high-speed linear motor platform;

4. The Z-axis is electrically adjustable to adapt to materials of different thicknesses and to meet specific taper hole processing requirements;

5. The range axis super-resolution industrial camera is used for full-frame error correction of the galvanometer, ultra-high-precision focusing, and online measurement to ensure the long-term stability and accuracy of the system;

6. The system adopts marble countertops to improve the overall stability of the system, and all mechanical components are carefully selected to ensure long-term accuracy;

7. The minimum processing micropore diameter is 5μm, the overall processing accuracy is ±4μm, the local feature accuracy is less than 3μm, and the processing width is 300*300mm;

8. It is used for precision micromachining of metals, ceramics, silicon wafers, glass, organics and other materials, such as micro-hole processing and precision cutting.

Compared with EDM micro-hole processing, mechanical drilling, chemical corrosion, mechanical punching, etc., laser precision micro-hole machining has the following advantages:

High speed (up to 4000 holes per second)

High precision (<3μm)

No material restrictions (metals, ceramics, silicon wafers, organics, etc.)

Programmable hole pattern (minimum 5μm, specific taper hole)

Distribution can be customized (processing width 300mm*300mm), no mold and mask required

No pollution and no consumables

direct processing

Note: Constant temperature (25±0.5℃), obtained after preheating for 30 minutes